Live Feeds
● LIVE Updated 1d ago · 16 sources tracked

Apple A20 Pro motherboard leak hints at notable memory and packaging upgrades

Leaked images of an alleged iPhone 18 Pro motherboard suggest the A20 Pro chip will use TSMC's Wafer-Level Multi-Chip Module technology. This redesign aims to improve thermals and performance. The chip is also expected to feature LPDDR6 memory and a larger neural engine.

RSS Source map (15)

What changed

New leaks specify the use of TSMC's WMCM packaging and LPDDR6 memory for the A20 Pro chip.

Live updates

  1. Leaked A20 Pro Motherboard Reveals New Packaging and Memory Upgrades

    Leaked images of an alleged iPhone 18 Pro motherboard suggest the A20 Pro chip will use TSMC's Wafer-Level Multi-Chip Module technology. This redesign aims to improve thermals and performance. The chip is also expected to feature LPDDR6 memory and a larger neural engine.

    What's confirmed:

    • The A20 Pro chip is rumored to use TSMC's Wafer-Level Multi-Chip Module packaging architecture.
    • The A20 Pro will likely feature LPDDR6 memory and a larger Neural Processing Unit.
    • The iPhone 18 and iPhone 18e are expected to feature 9GB of RAM and the A20 chip.
    • The A20 Pro packaging is designed to improve heat control and thermals.

    Still unconfirmed:

    • The A20 Pro may feature a 96-bit memory interface.
    confidence 80%